The 2DCC Slow-Speed Diamond Saw has unique control of the cutting parameters of a high-end wafer saw. The work is fed into the blade by several different methods by the use of table attachments. It is used to cut large hard crystals and cut sealed metallic tubes in order to remove the as-grown crystals from tubes.

slicing diamond saw

  • Motorized table provides unattended operation
  • High cutting accuracy using precision lead screws on all sample feed mechanisms
  • Versatile controls the power and range of blade speeds
  • Versatile sample holding