MCL's capabilities for characterizing the mechanical behavior and properties of materials has recently expanded due to a variety of new instrument acquisitions. This comprehensive array of instruments can characterize materials across a broad range of strengths and in a variety of environments. With the new equipment, we can now measure a variety of mechanical properties including yield stress, ultimate strength, hardness, moduli (Young's, shear, storage, loss), Poisson't ratio, Coefficient of Thermal Expansion (CTE), etc.. The mechanical equipment at MCL encompasses a variety of techniques, to accommodate the diversity of materials that come through MCL every day.
MTS Criterion 100 k N load frame with video extender and capacity with 1000 mm displacement
Expanded Capabilities towards Characterizing Mechanical Behavior at MCL. Details include:
- Thermomechanical analyizer
- Load frames and accessories
- Deformation and strain measuring devices
- Dynamic mechanical analyzer
- Wire electron-discharge machine (please visit the engineering shop services)
MCL has multiple instruments for characterizing the mechanical behavior of different materials.
- TA Instruments Q800 dynamic mechanical analyzer (N-007 MSC)
- Qness Q60 A+ microindenter (N-031D MSC)
- Netzsch 402 F1/F3 Hyperion thermomechanical analyzer (N-007 MSC)
- Correlated Solutions VIC-3D Digital Image Correlation (DIC) system (N-001 MSC)
- MTS load frames, load cells, grips, fluid bath, high temperature furnace, moderate temperature chamber (N-001 MSC)
Our staff at MCL is more than willing at assist you with chosing the correct instrument to meet your experimental parameters. The individual instrument pages detail the instrument's purpose; the grips/clamps, accessories, and attachments; and the instrument specifications.
Requirements are technique-specific. Please review the specific technique pages or contact a technical staff member to discuss your needs.
For sample preparation, MCL also has wire electron-discharge machining (wire-EDM) capabilities available.