Equipment & Training Schedule

Equipment List

Technical Contacts

Lavallee, Guy

Etch Technical Lead

gpl107@psu.edu
814-865-9339

N105 MILLENNIUM SCI COMPLEX
UNIVERSITY PARK, PA 16802

PSU UserID: 
gpl107

Miller, Shane

Process Engineer

spm145@psu.edu
814-865-3300

N154 MILLENNIUM SCI COMPLEX
UNIVERSITY PARK, PA 16802

PSU UserID: 
spm145

Fitzgerald, Andrew

Engineering Support Specialist

amf24
814-867-2657

N153 MILLENNIUM SCI COMPLEX
UNIVERSITY PARK, PA 16802

PSU UserID: 
amf24

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Etching

Etching

Details

Vapor Etching is another type of dry etch process. In vapor etching the reactive gas that is chosen will spontaneously reacts with a material in the vapor phase without needing to generate a plasma. An example of "Vapor Etching" is the etching of Si using XeF2 gas. Vapor etching is a very simple technique which like wet chemical etching has very good selectivity between different materials. This process is extremely isotropic in nature and is usually used in specific processed where one wants to release a device from the original substrate.

Equipment/Systems:

  • Xactix® XeF2 Release Etch Systems

    Isotropic etching of silicon using xenon difluoride is an ideal solution for releasing MEMS devices. XeF2 shows high selectivity to silicon over almost all standard semiconductor materials including photoresist, silicon dioxide, silicon nitride and aluminum. Being a vapor phase etchant, XeF2 avoids many of the problems typically associated with wet or plasma etch processes.

    RIMS Name

    Xactix XeF2 Etcher

    Training

    Visit the Equipment & Training Information