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The Materials Characterization Lab

 

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Sample Prep

 

General Sample Prep General Sample Prep
Sample Sectioning and Cutting Laser Cutter
Sputtering Leica Sputtering
Polishing and Mounting Polishing and Mounting image
Dicing Laser Cutter

An excellent sample preparation is key for observing the finest textures and details on the sample surface in high resolution.

Explore More

  • Characterization Techniques
    • Atomic Force Microscopy
    • Auger Electron Spectroscopy
    • Contact Angle
    • Density: Helium Pycnometry
    • Electrical Characterization Lab
    • Electron Backscattered Diffractometry
    • Electron Probe MicroAnalysis
    • Energy Dispersive Spectroscopy
    • Fluorescence Spectroscopy
    • Focused Ion Beam
    • High Temperature Processing
    • Indentation
    • Infrared Spectroscopy
    • Mechanical Load Frames / Limited Support
    • Nanoscale Infrared Spectroscopy
    • Optical Microscopy
    • Optical Profilometry
    • Particle Size Analysis
    • Raman Spectroscopy
    • Reflection Electron Energy Loss Spectroscopy
    • Sample Prep
      • General Sample Prep
      • Sample Sectioning and Cutting
      • Sputtering
      • Polishing and Mounting
    • Scanning Electron Microscopy
    • Software
    • Surface Area
    • Thermal Analysis
    • Transmission Electron Microscopy
    • Ultraviolet Photoelectron Spectroscopy
    • Ultraviolet-Visible-near-IR Spectroscopy
    • X-Ray Photoelectron Spectroscopy
    • X-ray Scattering
    • Zeta Potential
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Materials Research Institute
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    Millennium Science Complex
    491 Pollock Road
    University Park, PA 16802

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The 2DCC-MIP is funded by NSF cooperative agreement DMR-2039351.

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