Equipment & Training Schedule

Equipment List

Technical Contacts

Gehoski, Kathleen

Research and Development Engineer

Technical Lead

kag31@psu.edu
814-865-7443

N106 MILLENNIUM SCI COMPLEX
UNIVERSITY PARK, PA 16802

PSU UserID: 
kag31

Eichfeld, Chad

Nanofab Director of Operations

Nanolithography Engineer

cme133@psu.edu
814-865-8976

N-153 Millennium Science Complex
University Park, PA 16801

PSU UserID: 
cme133

Labella, Michael

Litho Process Engineer

mil102@psu.edu
814-863-4339

N106 MILLENNIUM SCI COMPLEX
UNIVERSITY PARK, PA 16802

PSU UserID: 
mil102

Subscribe

Free subscriptions to newsletters, print publications, and more

Lithography

Lithography

Surface Modification

AZ® BARLi® - II

AZ® BARLi® - II is a bottom antireflective layer coating for use on highly reflective surfaces in the semiconductor industry. It is designed to work with positive photoresists and is optimized for i-line exposure tools. Upon completion of the lithographic process, AZ® BARLi® - II is patterned in a dry-etch process.
MicroChemicals AZ® BARLi® - II Product Brochure

Omni Coat

HMDS

Process used for producing a 1-monolayer thick sticking layer on a surface prior to lithography.

ProTek®

This is a protective coating process that enables simple, effective wet-etching processes for silicon, compound semiconductors, and glass.
Brewer Science® ProTEK® website

Surpass 3000

A Cationic Priming Agent designed and formulated for use with photoresist on silicon, glass, nickel, gallium arsenate, indium tin oxide, and various other metallic and non-metallic substrates.
Visit DisChem Inc. for the Technical Data Sheet

Surpass 4000

A Cationic Priming Agent designed and formulated for use with photoresist on silicon, glass, nickel, gallium arsenate, indium tin oxide, and various other metallic and non-metallic substrates.
Visit DisChem Inc. for the Technical Data Sheet