The Plasma-Therm Versalock 700 is a dual chamber high-density inductively coupled plasma (ICP) etcher. The system has chlorine and fluorine chemistries plumbed to both chambers, but processes are segregated with one chlorine-based chamber and the other fluorine-based. This is a fully computer controlled system that can handle small parts through 150mm (6 inch) wafers.

CAPABILITIES

This is a partial list of materials etched. If you do not see your material listed here please ask the staff, Guy Lavallee or Shane Miller for guidance.

Ceramics
  • Lanthanum Calcium Manganese Oxide - LCMO
  • Lanthanum Strontium Manganite - LSM or Lanthanum Strontium Manganese Oxide - LSMO
  • Lithium Niobate (LiNbO3)
Dielectrics
  • Alumina (Al2O3)
  • Hafnium Oxide (HfO2)
  • Gorilla Glass
  • Iridium Oxide (IrO2)
  • Lanthanum Oixde (La2O3)
  • Quartz
  • Sapphire
  • Silicon Dioxide (SiO2)
  • Silicon Nitride (Si3N4)
  • Tantalum Oxide (Ta2O5)
  • Titanium Dioxide (TiO2)
Ferromagnetic
  • Gadolinium Nitride (GdN)
Metals
  • Aluminum (Al)
  • Antimony (Sb)
  • Chromium (Cr)
  • Gadolinium
  • Gold (Au)
  • Iron (Fe)
  • Molybdenum (Mo)
  • Palladium (Pd) (under development)
  • Platinum (Pt)
  • Tantalum (Ta)
  • Titanium (Ti)
  • Titanium Aluminum (TiAl)
  • Titanium Nitride (TiN)
  • Titanium Tungsten (TiW)
  • Tungsten (W)
Semiconductors
  • Aluminum Antimonide (AlSb)
  • Aluminum Gallium Arsenide (AlGaAs)
  • Aluminum Indium Arsenide (AlInAs)
  • Gallium Arsenide (GaAs)
  • Gallium Nitride (GaN)
  • Germanium (Ge)
  • Indium Arsenide (InAs)
  • Indium Gallium Arsenide (InGaAs)
  • Indium Phosphide (InP)
  • Silicon (Si)
  • Silicon Carbide (SiC)
  • Silicon Germanium (SiGe)
Polymers
  • BARLi anti-reflective coating (resist)
  • Carbon Nanotubes
  • poly(dioctyl-bithiophene) - PDOT
Others
  • Graphene
  • Graphene fluorination
  • Magnesium Arsenide (Mg3As2)
Transparent Conductive Oxides
  • Indium Tin Oxide - ITO (under development)
  • Zinc Tin Oxide -- ZTO

PROCESSES

There exists at least one process for each of the materials listed above.

NOTE: Since the system is used to etch a variety of different materials, a strict cleaning procedure (recipe) has been implemented to ensure process repeatability.