The Alcatel "Speeder 100SiO2" is an ICP Etching system which is configured for etch silicon using either the patented BOSCH Deep Silicon Etch Process or a Cryogenic etch process that are typically used in MEMS (Micro-ElectroMechanical Systems), microfluidics, and silicon masters for soft lithography stamps. The system is setup to process 4" wafers and uses etch masks of either photo resist or thermal oxide. The system also has both the LF and HF options for controlling the footing at the bottom of etched features.

FEATURES

  • The Alcatel Speeder 100 SiO2
  • Mechanical clamp with He backside cooling for precise temperature control
    • System can handle 4” wafers
  • Chuck Temperature is controlled using Liquid Nitrogen (LN2)
  • Excellent repeatability and stability
  • Fully Automated System

GASES

  • C4F8 (Octafluorocyclobutane)
  • SF6 (Sulfur hexafluoride)
  • O2 (Oxygen)

PROCESSES

  • The Bosch high frequency (HF) is the standard process for fast etching
  • The Bosch low frequency (LF) process is primarily used to etch silicon down to a buried oxide on a SOI wafer
  • Cryogenic etch results in smoother sidewalls than the Bosch processes