Scalable CMOS back-end-of-line-compatible AlScN/2D channel ferroelectric field-effect transistors
3D monolithic integration of memory devices with logic transistors is essential for augmenting computational power concurrent with enhanced energy efficiency in big data applications such as artificial intelligence. Ferroelectric field-effect transistors (FE-FETs) are a promising candidate, but requisite scalability and performance in a back-end-of-line process have proven challenging. Here we present BEOL-compatible FE-FETs using 2D MoS2 channels and AlScN ferroelectric materials, all grown via wafer-scalable processes.
