2D Semiconductors
We offer an exceptional portfolio of research programs and development in 2D materials and devices. We exploit the unique electronic, mechanical, and optoelectronic properties of atomically thin 2D semiconductors for next generations of high performance, ultra-low-power, flexible, reliable, artificially intelligent, radiation tolerant and inherently secure solid-state computing and storage devices and Internet of Things (IoT) sensors. We work collaboratively with semiconductor companies to accelerate the development of very largescale integrated circuits (VLSI) and brain-inspired neuromorphic chips based on 2D materials that can achieve "More than Moore” scaling.
Ferroelectric Microelectronics
Our research and development programs target technology that uses the third dimension in microelectronics for non-volatile 3D memory above CMOS logic to create memory devices densely interconnected with logic to enable lowpower, 3D non-von Neumann computation.
Micro-mechanical Systems (MEMS)
We are developing a new generation of micro-mechanical systems and devices that would incorporate shape-morphing materials to sense the environment, interact with each other, and perform self-coordinated tasks, with applications in communications, timing, and Internet of Things.
Organic Semiconductors
Organic semiconductors are an important focus of our research and development activities ranging from solar energy conversion to logic circuits. They include a variety of emerging organic semiconductor polymers, hybrid perovskite photovoltaic technologies, microscale concentrating photovoltaics, radiative cooling, and advanced antireflection coatings for the next generation of photovoltaic modules and prototyping next generation device configurations.
Internet of Things
We have multiple programs dedicated to fulfilling the promise of having trillions of devices connected wirelessly that dynamically share resources based on availability. Our researchers develop sophisticated piezoelectric materials for energy harvesting devices, highly directional and adaptive quantum antennas, and reduced size and power consumption CMOS circuitry and sensors to build the reliable wireless systems needed in industrial and real-world environments. We have testbed platforms enabled with industrial partnerships aiding the technological solutions for industry 4.0.
Quantum Packaging
The emerging field of quantum information technology exploits intricate quantum mechanical phenomena to create fundamentally new ways of obtaining and processing information. We are developing complex glass packaging to enable reliable access to quantum systems and materials from the macroscopic world without disturbing the quantum coherence of these delicate objects.
Packaging Solutions
We have multiple research activities focused on designing dielectric materials for high frequency and high thermal conductive interconnected substrates. These include polymers, polymer ceramic composites, and glass and ceramic substrates that can be assembled with multilayer structures and or 3D printed structures packaging devices. Combining new processing methods such as cold sintering offer unique opportunities in the integration of all classes of materials to significantly overcome limitations with traditional packaging solutions.
Wide Band Gap Semiconductors
Our faculty is exploring unique circuit architectures and diode and transistor devices that could reshape the future of semiconductors devices. We are developing wide bandgap semiconductor device and integration technologies for electronics with extreme capabilities in speed, power handling, and harsh environment hardness improving reliability. Our super heterojunction structures in GaN with switching voltages at 1.2kV open many new opportunities for novel applications.