Penn State leads semiconductor packaging, heterogeneous integration center (JUMP 2.0)

Image of a semiconductor chip in a motherboard

By Ashley WennersHerron

UNIVERSITY PARK, Pa. — The Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0), a consortium of industrial partners in cooperation with the Defense Advanced Research Projects Agency (DARPA), has announced the creation of a $32.7 million, Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES).

Mauricio Terrones

Mauricio Terrones

George A. and Margaret M. Downsbrough Department Head, Evan Pugh University Professor, Professor of Chemistry and Materials Science and Engineering

(e) mut11@psu.edu
(o) 814.865.0343
205A Osmond

https://sites.psu.edu/terronesresearch/
Suzanne Mohney

Suzanne Mohney

Professor of Materials Science and Engineering, and Electrical Engineering

(e) sem2@psu.edu, (e) mohney@ems.psu.edu
(o) 814-863-0744
N-209 Millennium Science Complex

Daniel Lopez

Daniel Lopez

Director of the Nanofabrication Lab
Liang Professor of Electrical Engineering and Computer Science

(e) ovl5064@psu.edu
(o) 814-867-1575
N-321 Millennium Science Complex

Saptarshi Das

Saptarshi Das

Associate Professor of Engineering, Science & Mechanics

(e) sud70@psu.edu
(o) 814-863-2639
N-333 Millennium Science Complex

https://sites.psu.edu/sdas/