Event lifts curtain on a bright future for materials research
By Jamie Oberdick
UNIVERSITY PARK, Pa. — You are reading this because of materials.
By Jamie Oberdick
UNIVERSITY PARK, Pa. — You are reading this because of materials.
By Ashley WennersHerron
UNIVERSITY PARK, Pa. — The Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0), a consortium of industrial partners in cooperation with the Defense Advanced Research Projects Agency (DARPA), has announced the creation of a $32.7 million, Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES).
By Adrienne Berard
President Joe Biden recently signed into law the CHIPS and Science Act, a $280 billion package to support domestic semiconductor manufacturing capabilities and increase research and development in the sector.
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