CHIPS Semiconductors

UNIVERSITY PARK, Pa. — Penn State held a Town Hall meeting recently to discuss internal strategies around semiconductor technologies and taking on a key role in partnering with other universities and industries centered on the U.S. government’s CHIPS (Creating Helpful Incentives to Produce Semiconductors) and Science Act, which was signed into law on Aug. 9, 2022.

By Matthew Carroll

UNIVERSITY PARK, Pa. – Advances in computing power over the decades have come thanks in part to our ability to make smaller and smaller transistors, a building block of electronic devices, but we are nearing the limit of the silicon materials typically used. A new technique for creating 2D oxide materials may pave the way for future high-speed electronics, according to an international team of scientists.

By Jamie Oberdick

UNIVERSITY PARK, Pa. — You are reading this because of materials.  

By Ashley WennersHerron

UNIVERSITY PARK, Pa. — The Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0), a consortium of industrial partners in cooperation with the Defense Advanced Research Projects Agency (DARPA), has announced the creation of a $32.7 million, Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES).

By Adrienne Berard

President Joe Biden recently signed into law the CHIPS and Science Act, a $280 billion package to support domestic semiconductor manufacturing capabilities and increase research and development in the sector.