Potential university partners share their vision of a regional semiconductor hub

Semiconductor

By Jamie Oberdick

As outlined in the CHIPS and Science Act, regional hubs would play a key role in an American semiconductor future.

Part of what will help make the CHIPS and Science Act a success is the concept of regional hubs, where partnerships among industry, government, and universities like Penn State will thrive. Penn State brings a lot of semiconductor expertise to the table, but what about potential university partners in the region? What would a joint university partnership look like?

Penn State’s Role in Setting a Course for America’s Semiconductor Future

Penn State's role

By Jamie Oberdick

Semiconductors are a big reason as to why you are reading this. This is not a reference to your interest in semiconductors as a subject, but the actual production of this website. Even if you are reading the print version of this article and not the online version, semiconductors played a role in creating that hard copy via word processing, graphic design, digital photography, and even the printer that printed the pages. Such is the ubiquitousness of semiconductor chips in our current society.

Town hall on CHIPS and Science Act envisions key role for Penn State

presenters speak to a roomful of people

UNIVERSITY PARK, Pa. — Penn State held a Town Hall meeting recently to discuss internal strategies around semiconductor technologies and taking on a key role in partnering with other universities and industries centered on the U.S. government’s CHIPS (Creating Helpful Incentives to Produce Semiconductors) and Science Act, which was signed into law on Aug. 9, 2022.

Two-dimensional oxides open door for high-speed electronics

Student works on 2D material in lab

By Matthew Carroll

UNIVERSITY PARK, Pa. – Advances in computing power over the decades have come thanks in part to our ability to make smaller and smaller transistors, a building block of electronic devices, but we are nearing the limit of the silicon materials typically used. A new technique for creating 2D oxide materials may pave the way for future high-speed electronics, according to an international team of scientists.

Penn State leads semiconductor packaging, heterogeneous integration center (JUMP 2.0)

Image of a semiconductor chip in a motherboard

By Ashley WennersHerron

UNIVERSITY PARK, Pa. — The Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0), a consortium of industrial partners in cooperation with the Defense Advanced Research Projects Agency (DARPA), has announced the creation of a $32.7 million, Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES).

Mauricio Terrones

Mauricio Terrones

George A. and Margaret M. Downsbrough Department Head, Evan Pugh University Professor, Professor of Chemistry and Materials Science and Engineering

(e) mut11@psu.edu
(o) 814.865.0343
205A Osmond

https://sites.psu.edu/terronesresearch/
Suzanne Mohney

Suzanne Mohney

Professor of Materials Science and Engineering, and Electrical Engineering

(e) sem2@psu.edu, (e) mohney@ems.psu.edu
(o) 814-863-0744
N-209 Millennium Science Complex

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