Equipment & Training Schedule

Equipment List

Technical Contacts

Drawl, William

Research and Development Engineer

wrd1@psu.edu
814-863-8558

N105 MILLENNIUM SCI COMPLEX
UNIVERSITY PARK, PA 16802

PSU UserID: 
wrd1

Jones, Beth

Research and Development Engineer

baj2@psu.edu
1-814-863-1694

N104 Millennium Science Complex University Park, PA 16802

PSU UserID: 
baj2

Liu, Bangzhi

Research Associate

bul2@psu.edu
814-863-0964

N154 MILLENNIUM SCI COMPLEX
UNIVERSITY PARK, PA 16802

PSU UserID: 
bul2

Fitzgerald, Andrew

Engeering Support Specialist

amf24
814-867-2657

N153 MILLENNIUM SCI COMPLEX
UNIVERSITY PARK, PA 16802

PSU UserID: 
amf24

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Deposition and Growth

Deposition and Growth

Thermal Oxidation

Thermal oxidation is a process for reacting gases (Oxygen in dry oxidation, water vapor in wet oxidation) with solid silicon substrates at high temperature ( 800°C-1200°C) in which the silicon substrate atoms are converted to silicon dioxide (SiO2).

Oxidation Processes

  • Ultrapure oxidation of silicon wafers can be accomplished in the Thermco oxidation furnace and offers high quality "dry" and wet oxidation processes. Samples are restricted to those without any metals.
  • Oxidation of silicon can also be carried out using the MRL (Black Max) system on substrates that have metals.

Equipment:


Thermco 2604 Oxidation Furnace

The Thermco 2604 silicon oxidation occupies one tube in the furnace. This small furnace offers economical small batch wet and dry oxidation of silicon wafers up to 150mm (6”) diameter.

Capabilities:

  • Autoloader
  • Can run up to 50 wafers per run
  • External torch for generating wafer for wet oxidation

Processes:

Silicon oxidation processes are typically run at 1100°C.

Restrictions:

Only MOS compatible materials allowed in the silicon oxidation system, but many non MOS materials are allowed in the Black Max system for oxidation of silicon.

RIMS Name:

LPCVD Thermco Oxidation

Training:

Please contact Guy Lavallee or Andy Fitzgerald for training or for users who do not need oxidation regularly please contact the staff to have the deposition done for them.


AG600 Allwin Rapid Thermal Annealer

Rapid thermal annealing of up to 6" wafers.  Used for rapid thermal annealing of films.  Has thermocouple and pyrometer temperature sensors available.

RIMS Name:

RTA AG610

Training:

Please contact Beth Jones for training. 


Blackmax Furnace

The MRL Thermtec BlackMax furnace has an 200mm process tube for running 150mm wafers.  Oxygen and Nitrogen gasses are available.

Processes:

Annealing, doping and oxidation are possible in this furnace.  Multiple tubes are available.

Restrictions:

Only approved processes and wafers.

RIMS Name:

Anneal: MRL (Black Max)

Training:

Please contact Guy Lavallee or Andy Fitzgerald for training or for users who do not need oxidation regularly please contact the staff to have the deposition done for them.


Specialty Furnace

The MRL Thermtec BlackMax furnace has 2 150mm process tubes for running 100mm wafers.  Oxygen and Nitrogen gasses are available.

Processes:

Annealing, doping and oxidation are possible in this furnace.  Multiple tubes are available.

Restrictions:

Only approved processes and wafers.

RIMS Name:

Anneal: Specialty Stack

Training:

Please contact Guy Lavallee or Andy Fitzgerald for training or for users who do not need oxidation regularly please contact the staff to have the deposition done for them.