Equipment & Training Schedule

Technical Contacts

Drawl, William

Research and Development Engineer

wrd1@psu.edu
814-863-8558

N105 MILLENNIUM SCI COMPLEX
UNIVERSITY PARK, PA 16802

PSU UserID: 
wrd1

Jones, Beth

Research and Development Engineer

baj2@psu.edu
1-814-863-1694

N104 Millennium Science Complex University Park, PA 16802

PSU UserID: 
baj2

Mahoney, Bill

Research Technologist

wjm122@psu.edu
814-865-6962

N152 MILLENNIUM SCIENCE COMPLEX
UNIVERSITY PARK, PA 16802

PSU UserID: 
wjm122

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Sputtering

Deposition & Growth

Kurt J Lesker CMS-18 sputter #1 (reactive) - Sputter

The CMS-18 is an extremely flexible three target reactive sputtering system with a load lock capable of small parts through 6" wafers.  It has 2 RF sources and one DC source with pulse functions. The system is capable of depositing multilayer film stacks, alloys, and reactively sputtered oxides and nitrides. The system is also setup for substrate heating as well as RF biasing and sample pre-cleaning.

Capabilities

Configuration
  • Computer controlled & recipe driven
  • Small parts through 6 inch substrates
  • Three cathode (target) system
    • 2 RF
    • 1 DC (pulsed capable 20 khz)
  • Substrate bias 100 Watts RF for pre-cleaning and ionization of reactive gases oxygen & nitrogen.
  • Substrate heating to 750C
  • Source gases
    • Argon (Ar)
    • Oxygen (O2)
    • Dilute oxygen in argon
    • Nitrogen (N2)
Deposited Films
  • Aluminum (Al)
  • Alumina (AlxOy)
  • Barium Titanate (BaTiO3)
  • Bismuth (Bi)
  • Chromium (Cr)
  • Copper (Cu)
  • Gadolinium (Gd)
  • Gadolinium Nitride (GdN)
  • Germanium (Ge)
  • Germanium Oxide (GeO2)
  • Gold (Au)
  • Indium (In)
  • Indium tin oxide (ITO)
  • Iridium (Ir)
  • Iron/Manganese (Fe/Mn)
  • Lithium Cobalt Oxide (LCO)
  • Magnesium (Mg)
  • Magnesium oxide (MgO)
  • Molybdenum (Mo)
  • Nickel (Ni)
  • Nickel Iron (NiFe)
  • Nickel/Chromium (NiCr, Nichrome)
  • Nickel Oxide (NiO2)
  • Niobium (Nb)
  • Niobium/Iron (Nb/Fe)
  • Platinum (Pt)
  • Silicon (Si)
  • Silicon Dioxide (SiO2)
  • Silicon Nitride (SixNy)
  • Silver (Ag)
  • Tantalum (Ta)
  • Tantalum (TaN)
  • Titanium Dioxide (TiO2)
  • Titanium Nitride (TiN)
  • Tantalum Carbide (TaC)
  • Tin (Sn)
  • Titanium (Ti)
  • Titanium-Diboride (TiB2)
  • Titanium/Tungsten (Ti/W)
  • Tungsten (W)
  • Vanadium (V)
  • Vanadium-Oxide (VOx)
  • Yttrium-Oxide (Y2O3)
  • Zinc (Zn)
  • Zinc-Oxide/Aluminum Oxide (ZnO/Al2O3)
  • Zirconium (Zr)

RIMS Name

Sputter: Kurt Lesker CMS-18 #1

Training

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Kurt J Lesker CMS-18 sputter #2 (nobel metal) - Sputter

Description

The CMS-18 is an extremely flexible two target reactive sputtering system with a load lock capable of small parts through 6" wafers. The system is capable of depositing multilayer film stacks as well as alloys. The system is also setup for substrate heating as well as RF biasing and sample pre-cleaning.

Capabilities

Configuration
  • Computer controlled & recipe driven
  • Small parts through 6 inch substrates
  • Two cathode (target) system
    • 2 DC
  • Substrate bias 100 Watts RF for pre-cleaning and ionization of reactive gases oxygen & nitrogen.
  • Substrate heating to 750C
  • Source gases
    • Argon (Ar)
    • Oxygen (O2)
    • Dilute oxygen in argon
    • Nitrogen (N2)
Films Deposited
  • Titanium
  • Platinum
  • Iridium
  • Gold
  • Chrome

RIMS Name

Sputter: Kurt Lesker CMS-18 #2

Training

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Kurt J Lesker CMS-18 sputter #3 (Complex oxides) - Sputter

Description

The CMS-18 is an extremely flexible four target reactive sputtering system with a load lock capable of small parts through 6" wafers. The system is capable of depositing multilayer film stacks, alloys, and complex oxides such as PZT (lead zirconate titanate). The system is also setup for substrate heating as well as RF biasing and sample pre-cleaning.

Capabilities

Configuration
  • Computer controlled & recipe driven
  • Small parts through 6 inch substrates
  • Four cathode (target) system
    • 2 RF
    • 2 DC
  • Substrate bias 100 Watts RF for pre-cleaning and ionization of reactive gases oxygen & nitrogen.
  • Substrate heating to 750C
  • Source gases
    • Argon (Ar)
    • Oxygen (O2)
    • Dilute oxygen in argon
    • Nitrogen (N2)
Films Deposited
  • Lanthanum Nickelate (LNO)
  • Lead Zirconate Titanate (PZT)
  • Lead Lanthanum Zirconate Titanate (PLZT)
  • Lead Magnesium Niobate - Lead Titanate (PMN-PT)
  • Manganese (Mn) doped PZT
  • Niobium (Nb) doped PZT
  • Platinum

RIMS Name

Sputter: Kurt Lesker CMS-18 #3

Training

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Kurt J Lesker CMS-18 sputter #4 (Reactive/Metals) - Sputter

Description

The CMS-18 is a flexible three target sputtering system with a load lock capable of small parts through 6” wafers. The system is capable of depositing multilayer film stacks and alloys. The system is also setup for substrate heating as well as RF biasing and sample pre-cleaning.

Capabilities

Configuration
  • Computer controlled & recipe driven
  • Small parts through 6 inch substrates
  • Three cathode (target) system
    • 2 RF
    • 1 DC
  • Substrate bias 100 Watts RF for pre-cleaning.
  • Substrate heating to 750C
  • Source gas: Argon (Ar)
Films Deposited
  • Aluminum (Al)
  • Aluminum Nitride (AlN)
  • Chromium (Cr)
  • Copper (Cu)
  • Germanium (Ge)
  • Gold (Au)
  • Iridium (Ir)
  • Iron/Manganese (Fe/Mn)
  • Magnesium (Mg)
  • Molybdenum (Mo)
  • Nickel (Ni)
  • Nickel Iron (NiFe)
  • Nickel/Chromium (NiCr, Nichrome)
  • Niobium (Nb)
  • Niobium/Iron (Nb/Fe)
  • Platinum (Pt)
  • Silicon (Si)
  • Silver (Ag)
  • Tantalum (Ta)
  • Tantalum Carbide (TaC)
  • Titanium Nitride (TiN)
  • Titanium (Ti)
  • Titanium-Diboride (TiB2)
  • Titanium/Tungsten (Ti/W)
  • Tungsten (W)
  • Vanadium (V)
  • Zirconium (Zr)

RIMS Name

Sputter: Kurt Lesker CMS-18 #4

Training

Visit the Equipment & Training Information