Oxidation | EquipmentThermco 2604 Oxidation FurnaceThe Thermco 2604 silicon oxidation occupies one tube in the furnace. This small furnace offers economical small batch wet and dry oxidation of silicon wafers up to 150mm (6”) diameter.CapabilitiesAutoloaderCan run up to 50 wafers per runExternal torch for generating wafer for wet oxidationProcessesSilicon oxidation processes are typically run at 1100C.Restrictions Skip to main content

Oxidation

The Thermco 2604 silicon oxidation furnace. Image: Courtesy Thermco Systems

Equipment

Thermco 2604 Oxidation Furnace

The Thermco 2604 silicon oxidation occupies one tube in the furnace. This small furnace offers economical small batch wet and dry oxidation of silicon wafers up to 150mm (6”) diameter.

Capabilities

Autoloader
Can run up to 50 wafers per run
External torch for generating wafer for wet oxidation

Processes

Silicon oxidation processes are typically run at 1100C.

Restrictions

Only MOS compatible materials allowed in the silicon oxidation system, but many non MOS materials are allowed in the Black Max system for oxidation of silicon.

Training: Please contact Guy Lavallee or Andy Fitzgerald for training or for users who do not need oxidation regularly please contact the staff to have the deposition done for them.
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