Solution found to problem bedeviling semiconductor researchers

Sapphire substrates

By Jamie Oberdick

Researchers from the National Science Foundation-sponsored Two-Dimensional Crystal Consortium (2DCC-MIP) - Materials Innovation Platform may have come up with a solution for a bottleneck that has confounded researchers trying to develop high-quality 2D semiconductors for next generation electronics such as Internet of Things (IoT) and artificial intelligence.  

New high-power thermoelectric device may provide cooling in next-gen electronics

next generation of high-power electronics

By Matthew Carroll

Next-generation electronics will feature smaller and more powerful components that require new solutions for cooling. A new thermoelectric cooler developed by Penn State scientists greatly improves the cooling power and efficiency compared to current commercial thermoelectric units and may help control heat in future high-power electronics, the researchers said.