New high-power thermoelectric device may provide cooling in next-gen electronics

next generation of high-power electronics

By Matthew Carroll

Next-generation electronics will feature smaller and more powerful components that require new solutions for cooling. A new thermoelectric cooler developed by Penn State scientists greatly improves the cooling power and efficiency compared to current commercial thermoelectric units and may help control heat in future high-power electronics, the researchers said.

Jorge Sofo

Jorge Sofo

Professor of Physics, Professor of Materials Science and Engineering

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