Whether during initial development of a device, in the scale up for manufacturing, or during an established manufacturing process, engineers often need to address thin film adhesion failures.  This talk will highlight some of the methods available within the Nanofab and MCL to characterize adhesion failures and thus help identify the necessary process modifications required to increase device quality and/or reproducibility.  We will use an example of a failure that occurred at a metal contact layer on a passivation oxide to walk through the testing decisions that lead to an understanding of the root cause.