Cross-sectional SEM imaging is commonly used in nanofabrication for coating thickness measurement, process verification, and failure analysis. Cleaving is frequently the method of choice for generating a cross-sectional sample for analysis.  However, this approach may inadvertently damage the sample which then poses challenges for accurate imaging.  By using a focused ion beam (FIB) instrument it is possible to create highly site specific cross sections with minimal artifacts for almost any structure/device/material.  In this talk I will highlight several applications for the efficient use of FIB ross-sectional imaging to accurately characterize a range of devices and layered material systems.