Technical Contacts

Lavallee, Guy

Etch Technical Lead

gpl107@psu.edu
814-865-9339

N105 MILLENNIUM SCI COMPLEX
UNIVERSITY PARK, PA 16802

PSU UserID: 
gpl107

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Vapor Etch

Etching

Xactix® XeF2 Release Etch Systems

Isotropic etching of silicon using xenon difluoride is an ideal solution for releasing MEMS devices. XeF2 shows high selectivity to silicon over almost all standard semiconductor materials including photoresist, silicon dioxide, silicon nitride and aluminum. Being a vapor phase etchant, XeF2 avoids many of the problems typically associated with wet or plasma etch processes.

RIMS Name

Xactix XeF2 Etcher

Training

Visit the Equipment & Training Information