Etch Technical Lead
N105 MILLENNIUM SCI COMPLEX
UNIVERSITY PARK, PA 16802
The Thermco 2604 silicon oxidation occupies one tube in the furnace. This small furnace offers economical small batch wet and dry oxidation of silicon wafers up to 150mm (6”) diameter.
Silicon oxidation processes are typically run at 1100C.
Only MOS compatible materials allowed in the silicon oxidation system, but many non MOS materials are allowed in the Black Max system for oxidation of silicon.
LPCVD Thermco Oxidation
Please contact Guy Lavallee or Andy Fitzgerald for training or for users who do not need oxidation regularly please contact the staff to have the deposition done for them.
Visit the Equipment & Training Information