Equipment & Training Schedule

Equipment List

Technical Contacts

Gehoski, Kathleen

Research and Development Engineer

Technical Lead

kag31@psu.edu
814-865-7443

N106 MILLENNIUM SCI COMPLEX
UNIVERSITY PARK, PA 16802

PSU UserID: 
kag31

Eichfeld, Chad

Research and Development Engineer

cme133@psu.edu
814-865-8976

N-153 Millennium Science Complex
University Park, PA 16801

PSU UserID: 
cme133

Labella, Michael

Litho Process Engineer

mil102@psu.edu
814-863-4339

N106 MILLENNIUM SCI COMPLEX
UNIVERSITY PARK, PA 16802

PSU UserID: 
mil102

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Lithography

Lithography

Electron Beam

Electron beam lithography can achieve the smallest features at ~10nm. It is a maskless technique that, like the laser writer, has as its input a CAD file and can write the pattern directly on the substrate. The electron beam of Penn State's Vistec 5200 is variable with a minimum of 2nm which is why such small features can be exposed.

The Vistec 5200 at Penn State has a specialized stage that allows it to expose substrates with extreme topography and curved surfaces.

Electron Beam Resists

  • PMMA: high resolution positive resist used for liftoff and etching
  • ZEP 520A: high resolution positive resist good for etching and can be used for liftoff
  • ZEP 7000-22: moderate resolution, but fast positive resist used primarily for etching
  • MMA-MAA copolymer for use under PMMA as for the bi-layer liftoff process
  • NEB-31 high resolution, fast negative resist used mostly for etching
  • HAS/XR5141: ultimate resolution negative resist

Equipment/Systems