Equipment & Training Schedule

Equipment List

Technical Contacts

Drawl, William

Research and Development Engineer

wrd1@psu.edu
814-863-8558

N105 MILLENNIUM SCI COMPLEX
UNIVERSITY PARK, PA 16802

PSU UserID: 
wrd1

Jones, Beth

Research and Development Engineer

baj2@psu.edu
1-814-863-1694

N104 Millennium Science Complex University Park, PA 16802

PSU UserID: 
baj2

Liu, Bangzhi

Research Associate

bul2@psu.edu
814-863-0964

N154 MILLENNIUM SCI COMPLEX
UNIVERSITY PARK, PA 16802

PSU UserID: 
bul2

Fitzgerald, Andrew

Engeering Support Specialist

amf24
814-867-2657

N153 MILLENNIUM SCI COMPLEX
UNIVERSITY PARK, PA 16802

PSU UserID: 
amf24

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Deposition and Growth

Deposition and Growth

Sputtering

Sputtering is a physical deposition technique that relies on the removal of a material from a target by energetic ion bombardment in order to coat a substrate with the target material. The technique can be combined with reactive gases to form oxides and nitride films. The Penn State Nanofab currently maintains 5 sputtering systems.

ITO Sputter Thin Films

ITO 3000 A Sputter thin filmsIndium tin oxide is a widely used transparent conducting oxide. Its electrical conductivity and optical transparency make this a desirable material for several applications. In thin film form ITO has been used in liquid crystal displays, flat panel displays, plasma displays, touch panels, organic light-emitting diodes, solar cells, antistatic coatings and EMI shielding.

ITO sputter thin films have been deposited in the Kurt J. Lesker CMS-18 sputtering system. The film displayed in the image was deposited onto a standard microscope slide at 300 C to a thickness of 3000 angstroms. The sheet resistance was measured with a four point probe and found to be 10 ohm-square.
ITO 3000 A Sputter Thin Films

Techniques

  • Nobel metals and adhesion promoter combinations such as titanium/platinum (Ti/Pt) and Cr/Au are deposited in Kurt Lesker Sputter #2
  • Reactive sputtering of oxides and nitrides as well as metals/semi-metals (including nobel metals) and metal compounds is done in Kurt Lesker Sputter #1 and #4
  • Sputtering of piezoelectric/pyroelectric/ferroelectric devices stacks that include PZT (lead zirconate titanate), PLZT (lead lanthanum zirconate titanate), and platinum (Pt) is done in Kurt Lesker Sputter #3.
  • An additional system from 4Wave is a unique blend of ion beam deposition and sputtering. Up to three source materials can be deposited simultaneously or in succession to deposit mixtures or multi-layered materials. The system offers the ability to precisely control the oxygen (or other reactive gas) content of the deposited film with the use of a fully integrated residual gas analyzer. (RGA) This has enabled better control of vanadium oxide deposition. Other materials will be added in the future.

Equipment/Systems


Four Wave Reactive Physical Vapor Deposition

The 4-Wave ion beam deposition system employs a low energy ion source to generate Ar ions. By applying a bias to the target or targets, the ions are accelerated to initiate the sputtering process. The flux of ions generated by the source aids in directing the sputtered material. The sputtered material is subsequently deposited down stream from the ion source.

Capabilities:

  • Can run three sources simultaneously or pulsed in a sequence
  • Excellent control of reactive sputtering processes are achievable with the RGA of partial pressures of reactant gases
  • Substrate is grounded
  • Pressure range is in the mid 10-4Torr
  • Well designed for the deposition of magnetic materials
  • Target utilization is very good
  • 4" substrates and smaller may be processed

RIMS Name:

Sputter: 4Wave Ion Beam Deposition System

Training:

Please contact William Drawl for training. 


 

Kurt J Lesker CMS-18 Sputter #1 (Reactive) 

The CMS-18 is an extremely flexible three target reactive sputtering system with a load lock capable of small parts through 6" wafers. The system is capable of depositing multilayer film stacks, alloys, and reactively sputtered oxides and nitrides. The system is also setup for substrate heating as well as RF biasing and sample pre-cleaning.

Capabilities:

  • Computer controlled & recipe driven
  • Small parts through 6 inch substrates
  • Three cathode (target) system
    • 2 RF
    • 1 DC (pulsed capable 20 khz)
  • Substrate bias 100 Watts RF for pre-cleaning and ionization of reactive gases oxygen & nitrogen.
  • Substrate heating to 750°C
  • Source gases
    • Argon (Ar)
    • Oxygen (O2)
    • Dilute oxygen in argon
    • Nitrogen (N2)

Deposited Films:

  • Aluminum (Al)
  • Aluminum/Titanium (Al/Ti)
  • Barium Titanate (BaTiO3)
  • Bismuth (Bi)
  • Chromium (Cr)
  • Copper (Cu)
  • Gadolinium (Gd)
  • Germanium (Ge)
  • Gold (Au)
  • Indium (In)
  • Indium tin oxide (ITO)
  • Iridium (Ir)
  • Iron/Manganese (Fe/Mn)
  • Lithium Cobalt Oxide (LCO)
  • Magnesium (Mg)
  • Magnesium oxide (MgO)
  • Molybdenum (Mo)
  • Nickel (Ni)
  • Nickel Iron (NiFe)
  • Nickel/Chromium (NiCr, Nichrome)
  • Niobium (Nb)
  • Niobium/Iron (Nb/Fe)
  • Platinum (Pt)
  • Silicon (Si)
  • Silver (Ag)
  • Tantalum (Ta)
  • Tantalum Carbide (TaC)
  • Tin (Sn)
  • Titanium (Ti)
  • Titanium-Diboride (TiB2)
  • Titanium/Tungsten (Ti/W)
  • Tungsten (W)
  • Vanadium (V)
  • Vanadium-Oxide (VOx)
  • Yttrium-Oxide (Y2O3)
  • Zinc (Zn)
  • Zinc-Oxide/Aluminum Oxide (ZnO/Al2O3)
  • Zirconium (Zr)

Processes:

There exists at least onestandard process for each of the films above plus there are reactive sputtering process for:

  • Alumina (AlxOy)
  • Gadolinium Nitride (GdN)
  • Silicon Dioxide (SiO2)
  • Silicon Nitride (SixNy)
  • Tantalum (TaN)
  • Titanium Dioxide (TiO2)
  • Titanium Nitride (TiN)
  • Vanadium Oxide (VOx)

RIMS Name:

Sputter: Kurt Lesker CMS-18 #1

Training:

Visit the Equipment Training Information Page to get details on how to get trained on this equipment 


Kurt J Lesker CMS-18 Sputter #2 (nobel metals)

Description:

The CMS-18 is an extremely flexible four target reactive sputtering system with a load lock capable of small parts through 6" wafers. The system is capable of depositing multilayer film stacks, alloys, and complex oxides such as PZT (lead zirconate titanate). The system is also setup for substrate heating as well as RF biasing and sample pre-cleaning.

Capabilities:

  • Computer controlled & recipe driven
  • Dual position load lock
  • Small parts through 6 inch substrates
  • Four cathode (target) system
    • 2 DC
  • Substrate bias 100 Watts RF for pre-cleaning and ionization of reactive gases oxygen & nitrogen.
  • Substrate heating to 750C
  • Source gases
    • Argon (Ar)
    • Oxygen (O2)
    • Dilute oxygen in argon
    • Nitrogen (N2)

Films Deposited:

  • Titanium
  • Platinum
  • Iridium
  • Gold
  • Chrome

RIMS Name:

Sputter: Kurt Lesker CMS-18 #2

Training:

Visit the Equipment Training Information Page to get details on how to get trained on this equipment 

 


Kurt J Lesker CMS-18 Sputter #3 (Complex oxides)

Description:

The CMS-18 is an extremely flexible four target reactive sputtering system with a load lock capable of small parts through 6" wafers. The system is capable of depositing multilayer film stacks, alloys, and complex oxides such as PZT (lead zirconate titanate). The system is also setup for substrate heating as well as RF biasing and sample pre-cleaning.

Capabilities:

  • Computer controlled & recipe driven
  • Dual position load lock
  • Small parts through 6 inch substrates
  • Four cathode (target) system
    • 2 RF
    • 2 DC
  • Substrate bias 100 Watts RF for pre-cleaning and ionization of reactive gases oxygen & nitrogen.
  • Substrate heating to 750°C
  • Source gases
    • Argon (Ar)
    • Oxygen (O2)
    • Dilute oxygen in argon
    • Nitrogen (N2)

Films Deposited:

  • Lead Zirconate Titanate (PZT)
  • Lead Lanthanum Zirconate Titanate (PLZT)
  • Lead Magnesium Niobate - Lead Titanate (PMN-PT)
  • Manganese (Mn) doped PZT
  • Niobium (Nb) doped PZT
  • Platinum

RIMS Name:

Sputter: Kurt Lesker CMS-18 #3

Training:

Visit the Equipment Training Information Page to get details on how to get trained on this equipment 

 


Kurt J Lesker CMS-18 Sputter #4 (Reactive/Metals)

Description:

The CMS-18 is a flexible two target sputtering system with a load lock capable of small parts through 6” wafers. The system is capable of depositing multilayer film stacks and alloys. The system is also setup for substrate heating as well as RF biasing and sample pre-cleaning.

Capabilities:

  • Computer controlled & recipe driven
  • Small parts through 6 inch substrates
  • Two cathode (target) system
    • 2 RF
    • 1 DC
  • Substrate bias 100 Watts RF for pre-cleaning.
  • Substrate heating to 750°C
  • Source gas: Argon (Ar)

Films Deposited:

  • Aluminum (Al)
  • Aluminum/Titanium (Al/Ti)
  • Chromium (Cr)
  • Copper (Cu)
  • Germanium (Ge)
  • Gold (Au)
  • Iridium (Ir)
  • Iron/Manganese (Fe/Mn)
  • Magnesium (Mg)
  • Molybdenum (Mo)
  • Nickel (Ni)
  • Nickel Iron (NiFe)
  • Nickel/Chromium (NiCr, Nichrome)
  • Niobium (Nb)
  • Niobium/Iron (Nb/Fe)
  • Platinum (Pt)
  • Silicon (Si)
  • Silver (Ag)
  • Tantalum (Ta)
  • Tantalum Carbide (TaC)
  • Titanium (Ti)
  • Titanium-Diboride (TiB2)
  • Titanium/Tungsten (Ti/W)
  • Tungsten (W)
  • Vanadium (V)
  • Zirconium (Zr)

RIMS Name:

Sputter: Kurt Lesker CMS-18 #4

Training:

Visit the Equipment Training Information Page to get details on how to get trained on this equipment