Equipment & Training Schedule

Equipment List

Technical Contacts

Drawl, William

Research and Development Engineer

wrd1@psu.edu
814-863-8558

N105 MILLENNIUM SCI COMPLEX
UNIVERSITY PARK, PA 16802

PSU UserID: 
wrd1

Jones, Beth

Research and Development Engineer

baj2@psu.edu
1-814-863-1694

N104 Millennium Science Complex University Park, PA 16802

PSU UserID: 
baj2

Liu, Bangzhi

Research Associate

bul2@psu.edu
814-863-0964

N154 MILLENNIUM SCI COMPLEX
UNIVERSITY PARK, PA 16802

PSU UserID: 
bul2

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Deposition and Growth

Deposition and Growth

Sputtering (Sputter)

Sputtering is a physical deposition technique that relies on the removal of a material from a target by energetic ion bombardment in order to coat a substrate with the target material. The technique can be combined with reactive gases to form oxides and nitride films. The Penn State Nanofab currently maintains 5 sputtering systems.

ITO Sputter Thin Films

ITO 3000 A Sputter thin filmsIndium tin oxide is a widely used transparent conducting oxide. Its electrical conductivity and optical transparency make this a desirable material for several applications. In thin film form ITO has been used in liquid crystal displays, flat panel displays, plasma displays, touch panels, organic light-emitting diodes, solar cells, antistatic coatings and EMI shielding.

ITO sputter thin films have been deposited in the Kurt J. Lesker CMS-18 sputtering system. The film displayed in the image was deposited onto a standard microscope slide at 300 C to a thickness of 3000 angstroms. The sheet resistance was measured with a four point probe and found to be 10 ohm-square.
ITO 3000 A Sputter Thin Films

Techniques

  • Nobel metals and adhesion promoter combinations such as titanium/platinum (Ti/Pt) and Cr/Au are deposited in Kurt Lesker Sputter #2
  • Reactive sputtering of oxides and nitrides as well as metals/semi-metals (including nobel metals) and metal compounds is done in Kurt Lesker Sputter #1 and #4
  • Sputtering of piezoelectric/pyroelectric/ferroelectric devices stacks that include PZT (lead zirconate titanate), PLZT (lead lanthanum zirconate titanate), and platinum (Pt) is done in Kurt Lesker Sputter #3.
  • An additional system from 4Wave is a unique blend of ion beam deposition and sputtering. Up to three source materials can be deposited simultaneously or in succession to deposit mixtures or multi-layered materials. The system offers the ability to precisely control the oxygen (or other reactive gas) content of the deposited film with the use of a fully integrated residual gas analyzer. (RGA) This has enabled better control of vanadium oxide deposition. Other materials will be added in the future.

Equipment/Systems