The researchers have developed a method for conformally coating substrates with semiconductors at lower temperatures than is possible with conventional chemical vapor deposition (CVD). The deposited semiconductor can infiltrate very small voids and spaces so that it is possible to deposit onto very large areas within static, rolled-up substrates.
There are many potential applications for low-temperature CVD methods in electronics and optics, medical devices, and multiple manufacturing technologies.
The inventive process is early-stage and applicable to multiple manufacturing technologies. The Penn State Research Foundation will provide additional information about the IP status and availability for commercialization.