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Electrode Sputtering

In an evacuated chamber, an argon partial pressure of approximately 0.05mbar is established through a gas dosing valve, and a glow discharge is ignited between an anode (specimen) and cathode (metal target) by means of high voltage. The resulting positively charged argon ions are accelerated toward the cathode and through their impingement knock metal atoms out (sputter) of the target. Numerous collisions occur between the sputtered metal atoms and the gas molecules in the process chamber, resulting in strong scattering of the metal atoms. These are deposited uniformly on the specimen(s) in the chamber.

 

Even on strongly fissured specimen surfaces a homogeneous, thin metal film is deposited, the conductivity of which is sufficient for scanning electron microscopy specimens. The conductivity depends not only on the target material but also on parameters such as working distance, gas pressure, glow current, and process duration. In practice the parameters are determined by the temperature resistance of the specimens.

 

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