| Bojan, Vince |
X-Ray Photoelectron and Auger Electron Spectroscopy Engineer |
| Clark, Trevor |
Focused Ion Beam Engineer |
| Daniel, Tad |
Atomic Force Microscopy Engineer |
| Drawl, William |
Physical and Chemical Vapor Deposition Process Engineer |
| Eichfeld, Chad |
Optical Lithography Process Engineer |
| Fedor, Jeffrey |
Tool and Lab Maintenance |
| Gehoski, Kathy |
Imprint Lithography Process Engineer |
| Grubb, Monica |
Accounting/Billing Coordinator |
| Huang, Changjun |
External Technical Liaison |
| Lavallee, Guy |
Reactive Ion Etch Process Engineer |
| Liu, Bangzhi |
Thin Film Deposition Process Engineer |
| Mansfield, William |
Director of Operations |
| Mayer, Theresa |
Site Director / Education Director |
| McCool, Leeanna |
Staff Administrator |
| Mieckowski, Andrzej |
Thin Film Deposition Process Engineer |
| Miller, Shane |
Reactive Ion Etch Process Engineer |
| Redwing, Ronald |
Outreach / REU Coordinator |
| Stapleton, Josh |
Microscopy and Optical Profilometry Technical Liaison |
| Stitt, Joe |
Confocal Raman Spectroscopy and Near-Field Scanning Optical Microscopy Engineer |
| Tang, Yan |
Nanolithography Process Engineer, Ebeam Training |
