CAPABILITIES
Penn State has integrated facilities/capabilities in the following categories:
Lithography Equipment
- Leica EBPG5-HR E-Beam Writer* (NEW REDUCED FEES!!)
- GCA 8000 i-line Stepper*
- Heidelberg DWL66 Laser Writer*
- Karl Suss MA/BA6 Contact Aligner with backside Alignment
- Karl Suss MJB3 Contact Aligners
- Resist Processing Stations
- Molecular Imprints Imprio 55 Nanoimprinter
- OAI Deep UV Flood Exposure
Thin Film Deposition Equipment
- Semicore Electron-beam Evaporator
- Kurt Lesker Thermal and Electron-beam Evaporator
- Kurt Lesker Lab-18 Thermal and Electron-beam Evaporator **NEW**
- Kurt Lesker CMS-18 DC/RF Sputtering Systems
- FEI Dual Beam Focusing Ion Beam
- Chemical Solution Deposition Station for complex ferroelectric oxides
- MRL 3 Stack LPCVD Furnace System
- Applied Materials P-5000 PECVD Cluster Tool
- Trion Technologies HDP ICP PECVD
- Cambridge Savannah™ 200 Atomic Layer Deposition
- Electroplating System capable of plating copper and gold
Plasma Etching Equipment
- Technics Micro Reactive Ion Etch
- PlasmaTherm 720
- Trion Technologies ICP Reactive Ion Etch
- Applied Materials MERIE Dielectric Etch
- Alcatel Deep Silicon Reactive Ion Etch
- Xactix XeF2 Etcher
- Tegal 6500 HRe Cluster Etch System for complex ferroelectric oxide etching
- Veeco Ion Mill
Thermal Processing Equipment
- Bruce 4 Stack Atmospheric Oxidation Furnace
- MRL (Black Max) Annealing Furnace
- Modular Processes Technology 600/610 Rapid Thermal Processing Tools
- AG610 Rapid Thermal Annealing System **NEW**
Chemical Nanofabrication & Characterization Equipment
- Molecular Imprints Imprio 55 Nanoimprinter
- Gloves Boxes for SAM Deposition and Chemical Solution Synthesis
- Soft Lithography processing bench
- Spec Coatings Parylene Thermal Evaporator
- Witec NSOM and confocal Raman
- Omicron NSOM and AFM
- Digital Instruments Atomic Force Microscopes
- JEOL 4500 AFM and STM
- Bruker Fourier Transform Infrared Spectrometer & Imaging Microscope
- Physical Electronics 670 Field Emission Auger Electron Spectroscopy
- Kratos Analytical Axis Ultra X-ray Photoelectron Spectroscopy
- Philips PRO MRD 4-circle high-resolution X-ray Diffraction System
- Wet Chemical Processing
Characterization Equipment
- Leitz Optical Microscopes
- Quanta 200 Environmental SEM with EDS
- JEOL 6700F FE-SEM with EDS
- LEO 1530 FE-SEM
- Micromanipulator 6000 Probe Station and Agilent C-V/I-V Test Equipment
- Gaertner Ellipsometer
- Nanospec Ellipsometer
- J. A. Woollam VASE Spectroscopic Ellipsometer
- Tencor 500 Profilometers
- Wyko NT110 Optical Profilometer
- Tencor Surfscan 4500 Surface Particle Inspection Analyzer
- Tencor Flexis 2320
- Four Point Probe
- Witec AFM
- Nanometrics 8000X SE ** NEW **
Additional PSU Facilities Available to Users of NNIN
NNIN staff will coordinate access to the professionally-staffed Materials Characterization Laboratory (MCL) and Center for Nanoscale Science (CNS) Shared Use Laboratory for remote and on-site access to additional materials and electrical characterization facilities.
- JEOL 2010 LaB6 TEM with EELS and EDS
- JEOL 2010F Field Emission TEM/STEM with EELS and EDS
- Philips 420, Tungsten-based 120 keV TEM
- CAMECA IMS 3f Secondary Ion Mass Spectrometry
- Finnigan MAT ICP Mass Spectrometry (high resolution with laser ablation)
- Leeman Labs PS3000UV ICP Atomic Emission
- Spectrametrix DCP Emission Spectrometry
- Dionex 100 Ion Chromatography
- X-ray Diffraction and Reflectivity (9 instruments)
- UV-Visible Spectroscopy
- Nanoparticle Characterization Equipment (Malvern Mastersizer & Zetasizer Nanosizers, Brookhaven ZetaPALS & Zeta Plus Analyzers, Liquid Surface Tensiometer, Helium Pycnometry)
- Thermal Analysis (TGA Mass Spectrometry, BET ASAP 2020 Surface Area and Porosimetry)
- Dielectric Property Electrical Measurements (3 automated electrical test systems for DC to RF)
- Nanomechanical and Thermal Property Measurements (up to 1600°C in reducing to oxidizing environments)
CNS Resources:
- Lakeshore Cryotonics TTP-4 probe station (to 4K and 3 Tesla vertical magnetic field)
- Quantum Design 6000 Physical Property Measurement System (´2, to 0.45 K and 9 Tesla magnetic field)
- Electrical Characterization Equipment (I-V, lock-in amplifiers, preamplifiers, spectrum analyzers, etc.)
- Nanomechanical Resonance Measurement (controlled ambient to 10-7 Torr)
- Nikon TE2000 Fluorescence Optical Microscopes and Optical Tweezers (´2)
- Interference Photolithography for 2 and 3D submicron patterning of periodic arrays of features
- Visible and Infrared Raman Systems
