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Penn State
NNIN at Penn State

TRAINING

 

Facility Safety Training and Orientation

 

Facility Safety Training and Orientation is a requirement for any person who will be entering the Nanofab (MRI) and EEW cleanrooms.

 

Safety Training is held every Tuesday from 9:00 am - 10:00 am in Room 186 MRI. 

 

See sidebar to the right for deviations to the regular schedule.


Contact NNIN at Penn State to schedule. 

 

 

 

Individual Equipment Training

 

 

 

 

Session One - General Overview (Group)

Tool Demonstration

Overview of the tool's capabilities

Contact NNIN at Penn State to schedule Session One Training at least 5 business days prior to schedule session

 

Session Two - Basic Principles (One-on-one)

Operate the tool under supervision

User is encouraged to bring a sample to the training session for processing

Contact the process engineer who conducted your first session to schedule session two

Session Three - Competence Testing (One-on-one)
Operate the tool under supervision Ask questions regarding operation and fundamental techniques User is encouraged to bring a sample to the training session for processing Contact the process engineer who conducted your first and second sessions to schedule session three
The instructor will determine if the user completed each training successfully, with good understanding of the tool.  If deemed necessary, any training may be repeated before full access to equipment is granted.

 

 

 

 

Weekly Calendar of Initial Equipment Training Sessions

 

Monday:

Nikon L200ND Optical Microscope Training 11:00 am - 12:00 pm Chad Eichfeld Cleanroom
PlasmaTherm 720 RIE Training 01:30 pm - 03:30 pm Guy Lavallee or Shane Miller 186 MRI
Black Max MRL Annealing Training 01:30 pm - 03:30 pm Andrzej Mieckowski or Bangzhi Liu Cleanroom
FESEM 01:30 pm - 04:30 pm Bangzhi Liu or Yan Tang 186 MRI
AMAT Cluster Tool Training 01:30 pm - 04:30 pm Bill Drawl or Guy Lavallee 191 MRI

Tuesday:

Facility Safety Training 09:00 am - 01:00 pm Joe Lonjin 186 MRI
LPCVD 3 Stack Furnace Training 09:00 am - 12:00 pm Andrzej Mieckowski or Bill Drawl Cleanroom
Electroplating Training 09:00 am - 10:00 am Andrzej Mieckowski Cleanroom
Nanometrics 8000X SE Training 01:00 pm - 02:00 pm Kathy Gehoski or Guy Lavallee Cleanroom
ALD (Atomic Layer Deposition) Training 01:30 pm - 02:30 pm Bangzhi Liu or Bill Drawl Cleanroom
M4L Training 01:30 pm - 02:30 pm Shane Miller or Guy Lavallee Cleanroom
Parylene Coater Training 02:00 pm - 05:00 pm Bangzhi Liu to Andrzej Mieckowski Cleanroom
Wet Bench Training 02:30 pm - 03:30 pm Andrzej Mieckowski Cleanroom
PlasmaTherm Versalock Dual Chamber Etch Training 02:00 pm - 04:00 pm Guy Lavallee or Shane Miller Cleanroom

Wednesday:

Tegal 6500 Cluster Etch Training 09:00 am - 11:00 am Guy Lavallee or Shane Miller 189 MRI

Lithography Intro and Training on Litho Resist Stations,

MA6 Contact Lithography & optical microscopes

09:00 am - 12:00 pm Kathy Gehoski or Yan Tang 114 MRI
Lab-18 Evaporator Training 09:00 am - 12:00 pm Andrzej Mieckowski or Bangzhi Liu Cleanroom
Kurt Lesker Evaporator Training 01:30 pm - 04:30 pm Bangzhi Liu or Andrzej Mieckowski Cleanroom
Xactix XeF2 Etcher Training 01:00 pm - 02:00 pm Shane Miller or Guy Lavallee 113 EEW Cleanroom

Thursday:

MJB3 Contact Lithography Training 09:00 am - 10:30 am Kathy Gehoski or Yan Tang Cleanroom
GCA8000 Stepper Training 09:30 am - 12:00 pm Chad Eichfeld or Kathy Gehoski Cleanroom
Ellipsometer Training 10:30 am - 11:30 am Andrzej Mieckowski or Bill Drawl Cleanroom
Semicore Evaporator Training 01:30 pm - 05:00 pm Bangzhi Liu or Andrzej Mieckowski Cleanroom
AMAT Stand Alone MERIE Training 01:30 pm - 04:30 pm Guy Lavallee or Shane Miller Cleanroom
KLA Tencor 500 and P16+ Profilometer Training 01:30 pm - 02:30 pm Chad Eichfold or Andrzej Mieckowski Cleanroom
Alcatel Deep Silicon Reactive Ion Etch Training 02:00 pm - 04:00 pm Shane Miller or Guy Lavallee 113 EEW Cleanroom

Friday:

Allwin21 Rapid Thermal Annealing Training 09:00 am - 11:00 am Andrzej Mieckowski Cleanroom

 

To register for any of the above Session One trainings, please contact NNIN at Penn State.

 

 

 

Kurt Lesker Sputtering System Training

 

Sputtering training is a three-session process.  Trainees should bring to session one, a substrate and a coating material.

 

Session One – Demonstration.  Learn about the system and procedures while the training engineer applies your first coating.


Session Two – Step-by-Step Talk Through.  The training engineer will talk you through the whole deposition procedure.  You will handle the substrates as well as manipulate the software.  Engineer will review several aspects of the system.


Session Three – Competence Testing.  You will operate the tool with the training engineer close by to answer questions or review anything that you do not understand or feel comfortable with while you apply your third deposition.


After session three, you will be considered a trained user.  For the first few times that you run the system on your own, you will be restricted to use during those times when the training engineer is in the building, so that he can be nearby to help if you have a problem.

 

Each training will be one and one half hours in length.  Training charges are $71/hour.
Once trained, your user fee will drop to $35/hour.  There is a material charge for AU and PT:  these are $65/1000A and $85/1000A respectively.

 

Sputtering training is done by appointment.  Please contact Bill Drawl William Drawl for training.

 

 

 

 

Leica EBPG5-HR E-Beam System Training

 

The Penn State Nanofab periodically conducts general training courses on the Leica EBPG5-HR E-Beam System.

 

The general training course is composed of three classroom sessions of 2 to 2.5 hours each and a 2.5-hour demo session conducted inside of the cleanroom.

 

Following the course each potential user will need to attend at least two one-on-one sessions in which he/she could do exposures on his/her own samples, in order to be fully qualified to use the system independently. 

 

The planned dates and times for the training sessions are:

 

Tuesday, October 18, 2011 2:00 - 4:00 pm
E-beam lithography fundamentals and EBPG5-HR system introduction

  

Thursday, October 20, 2011 2:00 - 4:00 pm
Setting up the column and exposure jobs

 

Tuesday, October 25, 2011 2:00 - 4:00 pm
Pattern fracturing software CATs and Applications 

 

Wed, Thurs, or Fri, Oct. 26,27,28, 2011 2:00 - 4:00 pm
Watch how to do a sample exposure inside of the cleanroom

 

All classroom sessions will be held in room 186 MRI Building.

Tune in here to find out when the next training session will be held.

The cost of the general training course will be $200 for academic users and $304.80 for non-academic users.  All trainees must have an established billing account and must be safety trained prior to the date of the last training session.  Photolithography spinner and bench training is also required prior to attending the cleanroom session. Please contact Jaime Reish Jaime Reish (865-7348) for assistance in establishing an account and arranging safety or litho training.

Please contact Chad Eichfeld Chad Eichfeld (865-8976) to register for Ebeam training.