TRAINING
Facility Safety Training and Orientation
Facility Safety Training and Orientation is a requirement for any person who will be entering the Nanofab (MRI) and EEW cleanrooms.
Safety Training is held every Tuesday from 9:00 am - 10:00 am in Room 186 MRI.
See sidebar to the right for deviations to the regular schedule.
Contact NNIN at Penn State to schedule.
Individual Equipment Training
- Trainees must attend a minimum of three successful training sessions for each piece of equipment.
- For most, all three sessions will take place within a 2-3 week period. Any user not completing all three sessions within the required timeframe may be requested to repeat trainings as deemed necessary.
Session One - General Overview (Group) |
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Tool Demonstration |
Overview of the tool's capabilities |
Contact NNIN at Penn State to schedule Session One Training at least 5 business days prior to schedule session
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Session Two - Basic Principles (One-on-one) |
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Operate the tool under supervision |
User is encouraged to bring a sample to the training session for processing |
Contact the process engineer who conducted your first session to schedule session two |
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Session Three - Competence Testing (One-on-one) |
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| Operate the tool under supervision | Ask questions regarding operation and fundamental techniques | User is encouraged to bring a sample to the training session for processing | Contact the process engineer who conducted your first and second sessions to schedule session three |
| The instructor will determine if the user completed each training successfully, with good understanding of the tool. If deemed necessary, any training may be repeated before full access to equipment is granted. | |||
Weekly Calendar of Initial Equipment Training Sessions
Monday: |
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| Nikon L200ND Optical Microscope Training | 11:00 am - 12:00 pm | Chad Eichfeld | Cleanroom |
| PlasmaTherm 720 RIE Training | 01:30 pm - 03:30 pm | Guy Lavallee or Shane Miller | 186 MRI |
| Black Max MRL Annealing Training | 01:30 pm - 03:30 pm | Andrzej Mieckowski or Bangzhi Liu | Cleanroom |
| FESEM | 01:30 pm - 04:30 pm | Bangzhi Liu or Yan Tang | 186 MRI |
| AMAT Cluster Tool Training | 01:30 pm - 04:30 pm | Bill Drawl or Guy Lavallee | 191 MRI |
Tuesday: |
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| Facility Safety Training | 09:00 am - 01:00 pm | Joe Lonjin | 186 MRI |
| LPCVD 3 Stack Furnace Training | 09:00 am - 12:00 pm | Andrzej Mieckowski or Bill Drawl | Cleanroom |
| Electroplating Training | 09:00 am - 10:00 am | Andrzej Mieckowski | Cleanroom |
| Nanometrics 8000X SE Training | 01:00 pm - 02:00 pm | Kathy Gehoski or Guy Lavallee | Cleanroom |
| ALD (Atomic Layer Deposition) Training | 01:30 pm - 02:30 pm | Bangzhi Liu or Bill Drawl | Cleanroom |
| M4L Training | 01:30 pm - 02:30 pm | Shane Miller or Guy Lavallee | Cleanroom |
| Parylene Coater Training | 02:00 pm - 05:00 pm | Bangzhi Liu to Andrzej Mieckowski | Cleanroom |
| Wet Bench Training | 02:30 pm - 03:30 pm | Andrzej Mieckowski | Cleanroom |
| PlasmaTherm Versalock Dual Chamber Etch Training | 02:00 pm - 04:00 pm | Guy Lavallee or Shane Miller | Cleanroom |
Wednesday: |
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| Tegal 6500 Cluster Etch Training | 09:00 am - 11:00 am | Guy Lavallee or Shane Miller | 189 MRI |
Lithography Intro and Training on Litho Resist Stations, MA6 Contact Lithography & optical microscopes |
09:00 am - 12:00 pm | Kathy Gehoski or Yan Tang | 114 MRI |
| Lab-18 Evaporator Training | 09:00 am - 12:00 pm | Andrzej Mieckowski or Bangzhi Liu | Cleanroom |
| Kurt Lesker Evaporator Training | 01:30 pm - 04:30 pm | Bangzhi Liu or Andrzej Mieckowski | Cleanroom |
| Xactix XeF2 Etcher Training | 01:00 pm - 02:00 pm | Shane Miller or Guy Lavallee | 113 EEW Cleanroom |
Thursday: |
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| MJB3 Contact Lithography Training | 09:00 am - 10:30 am | Kathy Gehoski or Yan Tang | Cleanroom |
| GCA8000 Stepper Training | 09:30 am - 12:00 pm | Chad Eichfeld or Kathy Gehoski | Cleanroom |
| Ellipsometer Training | 10:30 am - 11:30 am | Andrzej Mieckowski or Bill Drawl | Cleanroom |
| Semicore Evaporator Training | 01:30 pm - 05:00 pm | Bangzhi Liu or Andrzej Mieckowski | Cleanroom |
| AMAT Stand Alone MERIE Training | 01:30 pm - 04:30 pm | Guy Lavallee or Shane Miller | Cleanroom |
| KLA Tencor 500 and P16+ Profilometer Training | 01:30 pm - 02:30 pm | Chad Eichfold or Andrzej Mieckowski | Cleanroom |
| Alcatel Deep Silicon Reactive Ion Etch Training | 02:00 pm - 04:00 pm | Shane Miller or Guy Lavallee | 113 EEW Cleanroom |
Friday: |
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| Allwin21 Rapid Thermal Annealing Training | 09:00 am - 11:00 am | Andrzej Mieckowski | Cleanroom |
To register for any of the above Session One trainings, please contact NNIN at Penn State.
Kurt Lesker Sputtering System Training
Sputtering training is a three-session process. Trainees should bring to session one, a substrate and a coating material.
Session One – Demonstration. Learn about the system and procedures while the training engineer applies your first coating.
Session Two – Step-by-Step Talk Through. The training engineer will talk you through the whole deposition procedure. You will handle the substrates as well as manipulate the software. Engineer will review several aspects of the system.
Session Three – Competence Testing. You will operate the tool with the training engineer close by to answer questions or review anything that you do not understand or feel comfortable with while you apply your third deposition.
After session three, you will be considered a trained user. For the first few times that you run the system on your own, you will be restricted to use during those times when the training engineer is in the building, so that he can be nearby to help if you have a problem.
Each training will be one and one half hours in length. Training charges are $71/hour.
Once trained, your user fee will drop to $35/hour. There is a material charge for AU and PT: these are $65/1000A and $85/1000A respectively.
Sputtering training is done by appointment. Please contact Bill Drawl William Drawl for training.
Leica EBPG5-HR E-Beam System Training
The Penn State Nanofab periodically conducts general training courses on the Leica EBPG5-HR E-Beam System.
The general training course is composed of three classroom sessions of 2 to 2.5 hours each and a 2.5-hour demo session conducted inside of the cleanroom.
Following the course each potential user will need to attend at least two one-on-one sessions in which he/she could do exposures on his/her own samples, in order to be fully qualified to use the system independently.
The planned dates and times for the training sessions are:
| Tuesday, October 18, 2011 | 2:00 - 4:00 pm |
| E-beam lithography fundamentals and EBPG5-HR system introduction | |
| Thursday, October 20, 2011 | 2:00 - 4:00 pm |
| Setting up the column and exposure jobs | |
| Tuesday, October 25, 2011 | 2:00 - 4:00 pm |
| Pattern fracturing software CATs and Applications | |
| Wed, Thurs, or Fri, Oct. 26,27,28, 2011 | 2:00 - 4:00 pm |
| Watch how to do a sample exposure inside of the cleanroom | |
All classroom sessions will be held in room 186 MRI Building.
Tune in here to find out when the next training session will be held.
The cost of the general training course will be $200 for academic users and
$304.80 for non-academic users. All trainees must have an established billing account and must be safety trained prior to the date of the last training session. Photolithography spinner and bench training is also required prior to attending the cleanroom session. Please contact Jaime Reish
Jaime Reish
(865-7348) for assistance in establishing an account and arranging safety or litho training.
Please contact Chad Eichfeld
Chad Eichfeld
(865-8976) to register for Ebeam training.
