PLASMA ETCHING EQUIPMENT
XACTIX XEF2 SILICON DRY ETCH SYSTEM
Equipment Configuration
- Use to isotropically etch silicon for the primary purpose of releasing structures in MEM’s Devices
(The process is very selective to silicon over other materials like oxides, photoresists, aluminum, gold, and most nitride films. )
Available Gases
XeF2
Materials Processed
Silicon
Training
Training - Every Wednesday 1:00 pm - 2:00 pm
