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Penn State
NNIN at Penn State

CHEMICAL NANOFABRICATION & CHARACTERIZATION EQUIPMENT

WET CHEMICAL PROCESSINGWetChem

 

 

Equipment Configuration

 

The dedicated wet bench area which contains a variety of chemicals allows for extensive wet chemical processing.

 

Acid/Base Poly 1
Acid/Base Poly 2
Solvent Stainless Steel 1
Solvent Stainless Steel 2

 

Beco Etch Station 

This specialized wet station was designed for TMAH and KOH etching.  PID heating control, in-line filtering, and an all-teflon wetted pump work together to tightly control the process parameters.

 

Spin Rinse Dryers - General and non-metal

 

SC1/SC2 Wet Process Station 

This station houses chemical tanks and dump-rinses used for the RCA/Standard cleaning process.  Single samples up to full cassettes of 6" wafers can be cleaned for subsequent processing.  RCA 1 / SC1, RCA 2 / SC2, HF, Pirhana, and Spin Rinse Dryers are available.

 

 

Available Chemicals

 

Acids

Bases

Solvents

Etchants

Lithography

 

 

Available Transene Etchants

 

Chrome Etch 1020 Nickel Etch Type 1
Gold Etch TFA Nickel Etch TFB
Silver Etch TFS Titanium Etch TFTN

 

Transene Chemical Etchant Information (Etch Rates, etc.)

 

Etchant/Metal Compatibility Information

(Courtesy of Transene Company, Inc.)

 

Training

 

Training - Every Tuesday 2:30 pm - 3:30 pm