CHARACTERIZATION EQUIPMENT
KLA-TENCOR FLX-2320
The Tencor FLX-2320 is a thin-film stress measurement instrument. It accurately measures the changes in the radius of curvature of the substrate caused by the deposition of a stressed thin film on the substrate. 
Features include:
Laser scanning technology measures stress on all reflecting films. Can also measure stress as a function of time or temperature.
Sample leveling for accurate results.
Only one moving element in the optical components ensures low vibration and high accuracy.
Dual wave length windows based system used to measure the stresses in deposited thin films.
Analyzes the change in the radius of curvature of a substrate before and after the film has been deposited to calculate the film stress.
The stress that is measured is a combination of both the intrinsic stress (atomic structure of the film) and the thermal stress (caused by the difference in the Coefficient of Thermal expansion of materials).
Equipped with a heated chuck (20C to 500C) which allows for the direct measurement of the intrinsic stress of the films.
Ability to customize parameters.
100 – 200mm wafer size capability.
Training
As needed.
