THERMAL PROCESSING EQUIPMENT

ALWIN 21 AG610 RAPID THERMAL ANNEALING SYSTEM

Wafer Size 4” to 6” configuration
Small samples can be annealed if using a whole wafer carrier
AG610 system main frame.
Single Wafer Process.
Gold coated aluminum chamber with water cooling
Radiation heating lamp module
Precise Temperature/Time control
Multiple cycle processing capability
Steady Temp Range: 100°C to 1150°C for Thermocouple.
Steady state process time 0 to 30000 sec programmable
Temp Ramp-up Speed: 10°C to 80°C for wafer, Programmable
Ramp down speed 10°C - 80°C for wafer.
System includes Allwin21 Corp proprietary software package with Window graphic GUI and controller with One Pentium PC control. System provides advanced temperature control, process data SPC function capable, system Diagnostic and on line help. Equipped with software watch dog to eliminate damage to the machine due to the computer lock up at high lamp intensity. Software sensor checking to eliminate the sensor failure problem and to save every wafer.
A gas box with a computer controlled gas control board and three line gases each equipped with an MFC and Shut-off valves for each gas line.