THIN FILM DEPOSITION EQUIPMENT 
MRL 3 STACK LPCVD FURNACE SYSTEM
Equipment Configuration and Available Gases
- Silicon Nitride
Chemistry used: Ammonia, Dichlorosilane
- Polysilicon / Amorphous Silicon
Chemistry used: Silane
- LTO (Low Temperature Oxide)
Chemistry used: Silane, Oxygen
Materials Processed
Silicon wafers: 3 - 6 inch
Typical LPCVD Recipes
Training
Training - Every Tuesday 9:00 am - 12 pm
