LITHOGRAPHY EQUIPMENT
HEIDELBERG DWL66 LASER WRITER
Equipment Configuration
The Heidelberg DWL66 Laser Writer exposes photoresists on masks and samples. It exposes the user design pattern directly on the substrate and can do metrology on the samples as well.
- Expose small parts samples up through 8” wafers, including mask
- Minimum feature size is about 1.0 micron
- Front side and backside alignment
- Grayscale exposure
- Metrology:
- Overlay – measures relative position of two features on two different lithography levels
- Distance -- measure the distance between two features
- Positions – measures the die-to-die distances to check system linearity and orthogonality
- Line width – measures the width of lines (critical dimension measurement)
- Pitch, Stitching, Edge roughness
Details
- Accepts design files in the formats: CIF, DXF, GDSII, GERBER, HPGL and HIMT
- 442nm HeCd laser source
- A large set of write head objectives to optimize exposures
- 40 nm stage address grid
