THIN FILM DEPOSITION EQUIPMENT
KURT LESKER LAB-18 E-GUN/THERMAL AND ELECTRON BEAM EVAPORATOR
Equipment Configuration
This custom designed thermal/electron beam evaporator with in situ substrate cleaning capability and load locked deposition chamber was purchased with support from the Penn State MRSEC.
The system includes one four pocket e-beam source and a two post thermal sources that will enable co-evaporation. The 150 mm rotating substrate stage has the capability to cool substrates to - 20o C (short term) to address our chemical patterning focus area. The integral ion source can provide substrate cleaning or ion assisted deposition with energies from 35-150 eV. The system is computer controlled and employs recipe driven processes.
Sources
- Electron Beam (4 Crucible Pockets)
- Thermal/Resistive (2 sets of posts)
Components
- 2 Quartz Crystal Thickness/Rate Monitors
Sample Mounting
- Single wafer mount for 6" or smaller samples can be attached to tungsten wafer
- Sample rotation for uniform coatings
- Sample coolling for reducing thermal damage
Features/Details
- Recipe controlled/automated loading and deposition
- Dry Pumping Package
CTI Cryo-Pump and Edwards XDS Dry Scroll Roughing Pump
- Average Pump Down (Atmosphere - 1x10-6) 10-15 minutes
- Average Total Run Time - 1 hour
- Long throw with line-of-sight for excellent lift-off results
Dependent on amount of deposition
- Sample shutter and crucible shutter
- Additional feed-throughs
- Viewport to monitor sources before deposition
- Viewport to monitor wafer transfer
Materials Processed
| Aluminum | Gold | SiO2 |
| Chromium | Nickel | Titanium |
| Copper | Platinum | User's own material and others upon review |
Training
Training - Every Wednesday 9:00 am - 12:00 pm
