CHARACTERIZATION EQUIPMENT
KLA-TENCOR STYLUS P16+ PROFILOMETER
The KLA-Tencor Stylus P-16+ profiler is capable of scanning over a full 200mm wafer without stitching.
It has an extended range head that allows for measuring depths of up to 1mm with a force of .5-50mg.
The tools is capable of 2D and 3D surface profiling and stress measurements.
It also has integrated Apex 2D/3D advanced analysis software. Apex software provides the end user with additional capabilities for data analysis and report generation not available with Profiler software. It is a very user friendly software with the capability to create custom reports, perform SPC, advanced data filtering, texture analysis, form removal, zoom, symmetry, rotation, threshold, elimination of defects, volume and distance calculation, and traditional parameters for step height and roughness measurements.
We are in the process of obtaining a universal stress measurement chuck that will allow users to measure the stress in thin films deposited on wafers.
The KLA-Tencor P-16+ stylus profilometer is currently located in the Nanofab ballroom.
Equipment Configuration
- 20 site automated sequencing with deskew
- Integrated Apex 2D advanced analysis software and Apex 3D software
- 300 µm vertical range LVDC sensor
- Capable of greater than 4,000,000 data points per scan
- Variable sampling rate up to 2kHz
- 8 inch round tabletop
- Side and top view objective lens with 1400 x 1040 µm FOV (4.0X)
- 2 µm radius diamond stylus
- 200 mm scan length (no stitching required)
- Microhead 4 XR (extended range) measurement head with up to 1 mm vertical range (50 mg down to 0.5 mg force)
- Side and top view objective lens with 900 x 650 µm FOV (6.3X)
- 3D Apex Stress Measurement Package
- Universal Stree Measurement Chuck
Training
Training - Every Thursday from 1:30 pm to 2:30 pm
