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Penn State
NNIN at Penn State

PLASMA ETCHING EQUIPMENT

ALCATEL 'SPEEDER 100' DEEP SILICON REACTIVE ION ETCH

 

 

Equipment ConfigurationAlcatelRIE

 

The Alcatel “Speeder 100” is an ICP Etching system which is configured for etch silicon using either the patented BOSCH Deep Silicon Etch Process or a Cryogenic etch process.  The system is setup to process 4” wafers and typical etch masks for the processes are either SPR 200 resist or a thermal Oxide.  The system also has both the LF and HF options for controlling the footing at the bottom of

etched features.

 

 

Available Gases

 

C4F8, SF6, O2

 

 

Materials Processed

 

Silicon

 

 

Training

 

Training - Every Wednesday 2:00 pm - 4:00 pm