Orientation Imaging Microscopy (OIM)
Description
Orientation Imaging Microscopy (OIM) is based on automatic indexing of electron backscatter diffraction patterns (EBSP) which can be produced in a properly equipped SEM. OIM provides a complete description of the crystallographic orientations in polycrystalline materials.
Electron backscatter diffraction patterns (or EBSPs) are obtained in the SEM by focusing the electron beam on a crystalline sample. The sample is tilted to approximately 70 degrees with respect to the horizontal. The diffraction pattern is imaged on a phosphor screen. The image is captured using a low-light SIT camera. The bands in the pattern represent the reflecting planes in the diffracting crystal volume. Thus, the geometrical arrangements of the bands is a function of the orientation of the diffraction crystal lattice.
Rates
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Technique Advantages
- local phase and orientation information in sub-micron areas
Typical Applications
OIM is a powerful tool for investigating of polycrystalline microstructure including:
- Local crystallographic textures
- Grain Boundary Analysis
- Phase identification and relationship between phases
- Crystallographic analysis of microgram quantities of material
- Qualitative Strain Mapping
Sample Requirements
- maximum size = 10mm X 10mm X 10mm
- highly polished surface
Instrumentation
- TSL/EDAX OIM (only available on Hitachi S-3500N SEM in the MRL Bldg.)
Specifications
- Lateral resolution: 200 nm
- Sampling depth: 2-5 nm
Download OIM application note on austenite steel phase and textural analysis (469k)