Michael T. Lanagan
Title(s):
Associate Professor of Engineering Science and Mechanics
Associate Director, Materials Research Institute
Associate Director, Center for Dielectric Studies
Department:
Materials Research Institute
College/Admin. Unit:
Senior Vice President for Research
Office Address:
280 Materials Research Laboratory Building
University Park, PA 16802
Office Phone:
(814) 865-6992
Office Fax:
(814) 865-2326
E-Mail Address:
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Web Page(s):
Research Synopsis:
Research interests include development of new electronic materials for miniaturized devices, electronic property characterization at microwave and mm-wave frequencies, and materials integration. Co-processing dielectric and metals relies on understanding both kinetic and thermodynamic aspects of the fabrication process. The interrelationships between powder synthesis, sintering, structural tolerance and device properties provide new research opportunities for integrated electronic components.
Technologies Impacted by Research:
The rise of wireless technology has expanded the electronic market by 20% per year and has created new opportunities for dielectric-based components and materials. Future hand-held wireless applications will incorporate greater levels of integration, both in terms of discrete-like components, arrays, networks, modules, & embedded components into the package. Prototype integrated devices are presently being developed to understand how basic process and material properties affect performance.
Selected Publications: