4. Thin Film Characterization and Characterization Lab

The thin film deposition facilities include a multi-target dc magnetron sputtering system, a pulsed laser deposition system, an ion beam sputtering unit, and sol-gel chemistry facilities. Each of the vapor deposition techniques is equipped with a hot stage to enable deposition on a variety of substrates to temperatures of ~700C. The sol-gel facility includes a laminar flow hood, spinners, and a rapid thermal annealing unit to enable deposition on wafers up to 6" in diameter, as well as the necessary wet chemistry and dry box equipment. There is also an extensive array of dielectric and electromechanical characterization equipment available. These include impedance analyzers covering the range from 100 Hz - 1 MHz, a Radiant Technologies Ferroelectrics Test System, and HALT measurement apparatus. For piezoelectric measurements, single and double beam interferometry, as well as charge- based techniques for measurement of the d₃₁ and d₃₃ coefficients are available.

Photo 1.Thin film characterizing lab.

Photo 2. Pulse Laser Deposition Chamber

Smart Materials Integration Laboratory