3. Thick Film Prototyping Lab


The basis of our thick film laboratory is to take new materials and incorporate them into prototype devices to better access the performance. Both traditional thick film methods are utilized together with new technological development of methods such as electrophoretic deposition.

Thick Film Inks and pastes can be manufactured with an automatic mortar and pestle or three-roll mill. Inks and pastes can be printed using a production quality AMI screen printer, and fired in a production sized, atmosphere controlled Infrared belt furnace. Low temperature cofired ceramic tape can be cast, machined on a Schneider and Marquard Microhole punch, printed, and then laminated to create multilayer capacitors.

The electrophoretic deposition methods are being explored for ultrathin tapes. A method has been developed that enables tapes to be formed by electrophoretic deposition and then laminated into structures.

Devices that are presently being manufactured include multilayer capacitors, varistors, inductors, various integrated devices such as multilayer varistor capacitors, Z-chips, and low and broad pass RF-filters.

 

Smart Materials Integration Laboratory

 

 

 

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